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Samsung Electronics is said to have successfully completed NVIDIA’s quality assessment for its 12-layer HBM3E chip, a fifth-generation high-bandwidth memory.

As per the semiconductor industry, Samsung Electronics has recently cleared NVIDIA’s quality assessment for its 12-layer HBM3E product and is preparing to start deliveries. This follows about 19 months since the company first developed the product in February of last year. Although Samsung has been providing HBM3E to U.S. semiconductor design firms like AMD and Broadcom, it had previously failed NVIDIA’s quality checks several times. A representative from Samsung Electronics mentioned, “We are unable to confirm any details regarding our clients.”

HBM is a type of memory semiconductor utilized in artificial intelligence (AI) chips. It is created by layering several DRAM units, providing fast data processing capabilities. Key clients are leading AI chip manufacturers like NVIDIA. At present, SK Hynix supplies 75% of the HBM3E to NVIDIA. Samsung Electronics will join SK Hynix and Micron as the third company to provide HBM3E to NVIDIA.

Even though the volume supplied to NVIDIA is not significant, some analysts believe that Samsung Electronics, which faced criticism for being technologically behind after failing HBM3E quality tests, has now returned to a stable path. It is anticipated that the company may showcase its competitiveness in the upcoming competition, the sixth-generation HBM4. A source from the technology sector mentioned, “From NVIDIA’s point of view, depending on one supplier for HBM poses a risk,” and added, “Since Samsung has demonstrated its technical abilities with HBM3E to some extent, it is expected to be competitive in HBM4 as well.”