LG is accelerating its push into the AI data center, physical AI, and enterprise AI transformation markets by expanding its strategic collaboration with Microsoft. LG Electronics is also contributing to the global AI infrastructure market by leveraging its large-capacity liquid cooling system, which has received NVIDIA’s format certification for core AI data center equipment.
LG announced on the 22nd that Koo Kwang-mo, Chairman of LG Group, and Satya Nadella, CEO of Microsoft, attended a top-level executive meeting held on the 21st (local time) at Microsoft’s headquarters in Redmond, Washington, to expand their strategic partnership. The collaboration will focus on three areas: AI data center infrastructure, AI transformation, and physical AI.
In the AI data center sector, LG plans to supply cooling, power, and IT infrastructure solutions to align with Microsoft’s global data center expansion. In the short term, LG will provide large-capacity cooling solutions to major data centers, and in the medium to long term, it aims to broaden cooperation to include prefabricated data centers, where modules are pre-assembled in factories and then assembled on-site.
LG and Microsoft will also collaborate on AI transformation in work environments and physical AI. LG intends to utilize Microsoft 365 and MS Copilot, among other AI and cloud platforms, across its entire organization. Additionally, LG plans to use Microsoft’s cloud infrastructure for developing and training AI models in manufacturing, logistics, and mobility sectors.

LG Electronics also announced on the same day that its 2.5MW (megawatts)-class coolant distribution unit (CDU) has received NVIDIA’s ‘DSX Ready’ certification. NVIDIA grants this certification to products that meet the requirements for power, cooling, and networking needed to build its AI Factory, an AI data center based on the company’s technology. DSX is NVIDIA’s integrated platform for AI Factories.
LG Electronics previously received NVIDIA format certifications for its 600kW (kilowatts) and 1MW-class CDUs. LG Energy Solution’s battery energy storage system (BESS) was also approved as a DSX Ready product this time.
As the power density of AI servers increases, the importance of liquid cooling technology, which uses coolant instead of air, is growing. LG Electronics plans to expand its market presence by promoting its ‘chip-to-chiller’ solution, which covers the entire data center cooling process—from cold plates that directly cool chips to CDUs and chillers.





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